Turkish Journal of Physics
DOI
-
Abstract
The thermionic vacuum arc (TVA) is a new technique for the deposition of thin metallic films. Copper depositions were made on glass substrates placed at various distances and angles with respect to the TVA source. By measuring the thickness of the film on each substrate, the variation in the thickness as a function of the distance and angle with respect to the TVA source is investigated.
Keywords
Deposition, anodic vacuum arc, copper vapor plasma, thickness
First Page
219
Last Page
224
Recommended Citation
AKAN, TAMER and EKEM, NACİ (2003) "Variation in Thickness of Copper Films Deposited at Various Distances and Angles Using the Thermionic Vacuum Arc," Turkish Journal of Physics: Vol. 27: No. 3, Article 8. Available at: https://journals.tubitak.gov.tr/physics/vol27/iss3/8
