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Turkish Journal of Physics

Etching of Alumina and Polycarbonate Using a KrF Excimer Laser

Abstract

A KrF excimer laser operating at a wavelength of 248 nm was used to etch ceramic and polymer materials by direct ablation. Mesh pattern and circular holes were engraved in these materials and a Scanning Electron Microscope was used to analyse the results of the etching process. Etching rates of 0. 065-0.185 \mum/pulse for the ceramic and 0.5-1.06 \mum/pulse for the polymer were achieved using laser pulse energies on a target between 0.7-4. 0 mJ.

DOI

-

First Page

806

Last Page

812

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