Variation in Thickness of Copper Films Deposited at Various Distances and Angles Using the Thermionic Vacuum Arc


Abstract: The thermionic vacuum arc (TVA) is a new technique for the deposition of thin metallic films. Copper depositions were made on glass substrates placed at various distances and angles with respect to the TVA source. By measuring the thickness of the film on each substrate, the variation in the thickness as a function of the distance and angle with respect to the TVA source is investigated.

Keywords: Deposition, anodic vacuum arc, copper vapor plasma, thickness

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